- All sections
- B - Performing operations; transporting
- B23K - Soldering or unsoldering; welding; cladding or plating by soldering or welding; cutting by applying heat locally, e.g. flame cutting; working by laser beam
- B23K 26/386 - Removing material by boring or cutting by boring of blind holes
Patent holdings for IPC class B23K 26/386
Total number of patents in this class: 58
10-year publication summary
|
3
|
16
|
10
|
4
|
8
|
5
|
6
|
6
|
6
|
1
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Omron Corporation | 6968 |
10 |
| Corning Incorporated | 9932 |
6 |
| Skyworks Solutions, Inc. | 3450 |
5 |
| Rtx Corporation | 8674 |
3 |
| Applied Materials, Inc. | 16587 |
2 |
| Disco Corporation | 1745 |
2 |
| Eissmann Automotive Deutschland GmbH | 32 |
2 |
| Electro Scientific Industries, Inc. | 416 |
2 |
| Mitsui Mining & Smelting Co., Ltd. | 1373 |
2 |
| Samsung Electronics Co., Ltd. | 131630 |
1 |
| Samsung Display Co., Ltd. | 30585 |
1 |
| The Boeing Company | 19843 |
1 |
| Infineon Technologies AG | 8189 |
1 |
| Mitsubishi Electric Corporation | 43934 |
1 |
| Boston Scientific Scimed, Inc. | 8794 |
1 |
| Murata Manufacturing Co., Ltd. | 22355 |
1 |
| Kyocera Corporation | 12735 |
1 |
| IPG Photonics Corporation | 494 |
1 |
| M-solv Ltd. | 46 |
1 |
| Nippon Electric Glass Co., Ltd. | 2299 |
1 |
| Other owners | 13 |